As part of the French Recovery Plan, Teledyne e2v Semiconductors and Safran Electronics & Defense have jointly obtained a French state aid to develop their System-in-Package roadmap
GRENOBLE, FRANCE - Media
OutReach - 18 June 2021 - Teledyne e2v Semiconductors (Grenoble)
and Safran Electronics & Defense (Valence), are currently launching the
CORAIL SiP (System-in-Package) project with a significant state aid from the
French government. The CORAIL SiP project was created to accelerate
investments in order to boost the new electronic sector for System-in-Package
This collaborative project shows a common desire to quickly
position themselves as leaders for SiP capabilities in order to successfully
transform factories and build local supply chains. Both companies are
complementary and will develop solutions for System-in-Package based on
different technologies adapted to the specific needs of their various markets.
The CORAIL SiP project will reach a total amount of 7.5M € for
the entire consortium. It includes a contribution of 2.5M € from the French
Recovery Plan, that supports innovation and the development in France of highly
qualified jobs associated to advanced SiP manufacturing. This collaborative
project will be launched in Summer 2021 and will end in 2024. It will
accelerate the developments of Teledyne e2v Semiconductors' new SiP products
dedicated to the Aerospace and Defense markets, and also enable the expansion
of SiP services throughout the European industry.
The global development of SIPs is a natural evolution of
microelectronics. However most suppliers are located in Asia and do not address
low and medium volume market's needs. The CORAIL SiP project will allow both
partners to serve such needs for SiP in Europe.
The issuer is solely responsible for the content of this announcement.
About Teledyne e2v Semiconductors:
Teledyne e2v offers high-performance, ultra-reliable
semiconductor solutions addressing critical functions across the entire signal
chain – covering data converters, interface ICs, microprocessors, analog
switches, voltage references, digitizers, logic, memory and RF devices. Serving
the avionics, industrial, medical, military, scientific and space sectors, the
company is recognized as a world leader in the re-engineering and up-screening
commercial technologies to deal with the most demanding of application
Many of Teledyne e2v's products are developed through strategic
partnerships with leading semiconductor vendors – such as NXP, Everspin and
Micron. By working closely with its global client base, the company is able to
provide an expansive array of innovative solutions. These span all the way from
standard and semi-custom through to fully customized options.