Teledyne e2v Semiconductors is preparing for the future and upgrading its assembly and test cleanroom
Grenoble, France - Media
OutReach - 10 May 2021 - On Tuesday May 4th 2021, the first stone was
laid to launch the upgrade work of the semiconductors assembly and test clean
room at the factory near Grenoble, France. This project is named "GECkO" which
stands for "Growth Efficiency by Cleanroom Optimization".
Teledyne e2v Semiconductors is a manufacturer of high
performance & high reliability electronic components. All products such as
microprocessors, data converters, and imagery solutions are marketed worldwide,
for industrial, medical, civil and military avionics applications, and space.
The actual assembly and test clean room measures 2000 m² and
has been created in 1989. This upgrade will allow to optimize production flows
while enhancing the principle of Lean manufacturing to increase
competitiveness. Manufacturers use Lean manufacturing principles to eliminate
waste, optimize processes, cut costs, and boost innovation based on the
understanding of customer needs.
This project will also reduce our environmental impact with
an energy-efficient room and will be adaptive in order to prepare for new
technologies and offer an improved quality of work life to employees.
The GECkO project was launched in March 2019 and is a real
business project, which includes a multidisciplinary team working in
collaborative mode on a 3D model of the future clean room. After elaborating
the pre-study, choosing the ideal location and selecting optimal service
providers, the works are now starting. They will take place in three phases in
order to maintain production and ensure continuous product delivery for all
customers. Phase 1, lasting about a year, covers the first half of the new
This investment illustrates the confidence placed by the
Teledyne group and its desire to develop manufacturing activities on the
Grenoble France site.
The issuer is solely responsible for the content of this announcement.
About Teledyne e2v Semiconductors:
Teledyne e2v offers high-performance, ultra-reliable
semiconductor solutions addressing critical functions across the entire signal
chain – covering data converters, interface ICs, microprocessors, analog
switches, voltage references, digitizers, logic, memory and RF devices. Serving
the avionics, industrial, medical, military, scientific and space sectors, the
company is recognized as a world leader in the re-engineering and up-screening
commercial technologies to deal with the most demanding of application
Many of Teledyne e2v's products are developed through
strategic partnerships with leading semiconductor vendors – such as NXP,
Everspin and Micron. By working closely with its global client base, the
company is able to provide an expansive array of innovative solutions. These span
all the way from standard and semi-custom through to fully customized options.